• AI Application (HDI)
    • AI Application (HDI)
    AI Application (HDI)

    Construction

    Technical Aspect

    Layer

    6L

    Material

    High Speed Tg 170

    Board Thickness

    1.6mm

    Surface Finish

    ENIG

    Copper Weight

    1 Oz

    Special Requirement

    (2+n+2), Blind Via, Buried Via, Impedance

    Product Introduction
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    (852) 2142 5775
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